Achieving high-aspect-ratio trench pattern wafers with deep etching technology.
Our company strongly supports customers' technology and product development with test wafers using advanced semiconductor technology. (Bare Si wafers / Film-coated wafers / Patterned wafers) The trench patterned wafer 'PT063' achieves a high aspect structure through deep etching technology using the Bosch process. Our standard layout features trench patterns with mask dimensions ranging from 0.2µm to 10µm, with a maximum aspect ratio of approximately 40 to 65. We recommend this product as a solution to meet the needs of those seeking to enhance development efficiency. Please make use of it. *For more details, please download the PDF or feel free to contact us.
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basic information
- Wafer size: 200mm - Number of shots: 89 - Mask dimensions: 0.2µm~10µm - Maximum aspect ratio: approximately 40~65 (*We also accept high aspect ratio requests due to backfilling.) - Chips can be purchased from a single wafer. *For more details, please download the PDF or feel free to contact us.
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Delivery Time
※The delivery time may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
Film Coverage Evaluation
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Company information
Our company has been continuously supporting our customers' technology and product development with advanced semiconductor technology using test wafers for over 20 years. Our know-how and experience have transcended the boundaries of semiconductor manufacturing and culminated in the development of the gas instant heating component, the "Heat Beam Cylinder." This technology is expanding its application not only in the semiconductor field but also across various industrial sectors, demonstrating its achievements and effectiveness. If you have any technical inquiries or product requests, please feel free to contact us at any time.