フィルテック　 Product Lineup

Our company provides solutions for test wafers backed by advanced semiconductor technology, comprehensively supporting the evaluation and development of our customers' equipment, materials, and processes. The service for evaluating charge-up damage is available for 12-inch wafers and has been globally recognized for a long time. We can evaluate charge-up for dry etching, plasma CVD, sputtering, and ion implantation. We support wafer sizes of 300mm, 200mm, and chip measurements, measuring wafers treated with plasma in our customers' equipment and providing data for I/V curves and Vbd maps. Additionally, TDDB (Qbd) measurement services are also available. *For more details, please download the PDF or feel free to contact us.

• Other semiconductors

For over 20 years, our company has been strongly supporting our customers' technology and product development with cutting-edge semiconductor technology, particularly in the area of test wafers. Our expertise shines especially in the field of patterned wafers. The patterned wafers we offer include standard layouts such as Line & Space, hole patterns, and pillar patterns. Additionally, we can flexibly respond to our customers' diverse needs in material selection, including Si, SiO2, Poly-Si, and resist. Furthermore, we also accept custom designs beyond standard layouts. Based on our customers' pattern layout proposals, we provide a consistent service from the creation of dedicated CAD files to mask manufacturing. Our network extends beyond domestic boundaries, utilizing semiconductor manufacturing networks around the world to propose optimal and high-quality solutions to our customers. If you have any technical inquiries or product requests, please feel free to contact us.

• Other semiconductors

Our company provides test wafer solutions backed by advanced semiconductor technology, comprehensively supporting the evaluation and development of our customers' equipment, materials, and processes. Our range of offerings starts with bare wafers and extends to blanket film wafers, patterned wafers, CMP evaluation wafers, plasma charge monitor wafers, TSV evaluation wafers, electrical characteristic evaluation wafers, and MEMS mixed wafers. Our strength lies in the deep expertise and 20 years of experience of our expert team in semiconductor development. This, combined with the technology and know-how accumulated through trusted relationships with our customers, enables us to respond swiftly and reliably to their diverse needs. Furthermore, we leverage our semiconductor manufacturing network spread across the globe to propose optimal solutions. If you have any technical inquiries or product requests, please feel free to contact us. We are always committed to providing the best support as a partner in your success.

• Other semiconductors

Our company supports customers' technology development with semiconductor technology for test wafers. We provide services for test wafers, including bare Si wafers, film-coated wafers, and patterned wafers. Our services for evaluating charge-up damage are available even for 12-inch wafers and have been globally recognized for a long time. We can evaluate charge-up using dry etching, plasma CVD, sputtering, and ion implantation, with wafer sizes accommodating 300mm, 200mm, and chip measurements. We measure wafers that have undergone plasma treatment on the customer's equipment and provide data for I/V curves and Vbd maps. Additionally, TDDB (Qbd) measurement services are also available. *For more details, please download the PDF or feel free to contact us.

• Other semiconductors
• Heat exchanger

Our company strongly supports customers' technology and product development with test wafers using advanced semiconductor technology. (Bare Si wafers / Film-coated wafers / Patterned wafers) The trench patterned wafer 'PT063' achieves a high aspect structure through deep etching technology using the Bosch process. Our standard layout features trench patterns with mask dimensions ranging from 0.2µm to 10µm, with a maximum aspect ratio of approximately 40 to 65. We recommend this product as a solution to meet the needs of those seeking to enhance development efficiency. Please make use of it. *For more details, please download the PDF or feel free to contact us.

• Wafer

The high-efficiency compact heat exchanger (Heat Beam Cylinder) is small yet capable of efficiently and instantaneously heating fluids such as gases and liquids to high temperatures, reaching up to around 1000°C. Superheated steam has various applications, including drying, sterilization, and volume reduction. The industries that utilize it are diverse, including industrial waste, semiconductors, metals, gas, food, and healthcare. Our company has started a demonstration of "oxygen-free annealing using superheated steam." Annealing can be performed without nitrogen and without discoloration, reducing running costs. It allows for annealing that takes advantage of the properties of superheated steam, which easily reacts with organic materials. *For more details, please refer to the related links or feel free to contact us.

• Other environmental equipment

The "Heat Beam Cylinder" is compact yet capable of efficiently and instantly heating fluids such as gases and liquids to high temperatures, reaching up to around 1000°C. It is a clean heating method, making it suitable for heating process gases. By using high-temperature N2 generated by heating nitrogen in the exhaust line of semiconductor manufacturing equipment, it can prevent the adhesion of reaction products. Additionally, water can be directly heated to create a superheated steam generation device, which is expected to have various applications. 【Features】 ■ Generates superheated steam at over 900°C, allowing for use in a wide range of fields ■ Its compact size enables the generation of superheated steam close to the point of use ■ Direct generation of superheated steam from water is possible, eliminating the need for a boiler ■ Flexible arrangement and combination options allow for parallel, series, vertical, horizontal, and direct connection to devices *For more details, please refer to the PDF document or feel free to contact us.

• Other environmental equipment

Filtech Co., Ltd. supports your technology development with test wafers and compact high-efficiency heat exchangers (heat beam cylinders). In our test wafer service, we provide bare Si wafers, film-coated wafers, patterned wafers, and more. Additionally, we offer services for evaluating charge-up damage on wafers, which are available even for 12-inch wafers and are globally recognized. 【Business】 ■ Test Wafer Solution Business ■ Equipment Parts Business ■ Consulting Business *For more details, please download the PDF or feel free to contact us.

• Other semiconductors