We will make it to the final thickness! A slight change can have a big impact.
We would like to introduce our wafer process "Grinding" in semiconductor manufacturing. After slicing, the wafer is ground to remove burrs and surface contaminants, achieving the final thickness of the wafer. The Dubrin rotary union ensures a uniform grinding allowance during the process, while the Dubrin water rotary union keeps the grinding surface at a low temperature. [Features] - The Dubrin rotary union guarantees a uniform grinding allowance during the process. - The Dubrin water rotary union maintains a low temperature on the grinding surface. *For more details, please refer to the related links or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the related links or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the related links or feel free to contact us.
Company information
Since our establishment in 1945, we have maintained the philosophy of providing our customers with the best products as a dedicated manufacturer of rotary joints. In recent years, we have also created unique products based on our original design concepts in slip rings, which facilitate the exchange of electrical signals, data, and power in rotating bodies. To realize our customers' visions, we will propose strong solutions through our skilled engineering team and modern manufacturing facilities. We will provide the best products that truly satisfy our users. We have launched a Japanese website. https://www.deublin.com/ja-JP/
![[KXB] Explosion-proof packing type union](https://image.mono.ipros.com/public/product/image/085/2000872616/IPROS27635648323277330683.jpeg?w=280&h=280)
