[Meiko Theory 3] V-slit is not recommended as a countermeasure against solder balls.

The reasons for occurrence are diverse! A stable supply speed is achieved through the supply of wire solder.

In the industry, it is commonly understood that methods such as V-slit processing, hole drilling, and preheating for wire solder are effective for reducing solder balls, and these are actively proposed to users. However, in our view, the above measures cannot completely eliminate solder balls and may significantly impair the soldering process itself, so we do not make such proposals. The reasons for the occurrence of solder balls are diverse, and one example of the generation principle is that solder can scatter and form solder balls due to the explosive phenomenon of moisture-absorbing impurities present in the flux components. One of the causes of the flux explosion phenomenon is the rapid temperature rise of wire solder due to the high temperature of the soldering iron tip. Therefore, by using a double motor for the supply of wire solder, we have achieved a stable supply speed, resulting in certain success in preventing the explosion phenomenon. *For more details, please refer to the PDF document or feel free to contact us.*

Soldering Equipment