Multi-chip die bonder
The company's device is a customizable multi-chip die bonder that can be adjusted according to accuracy, bonding method, and cycle time. It can mount multiple types of chips on a single substrate, with a selectable accuracy range of ±2µm to ±25µm. By using options, it is possible to change the accuracy, bonding method, and cycle time. (Once the accuracy, bonding method, or cycle time has been changed, it cannot be modified again.)
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basic information
【Main Specifications】 - Alignment Accuracy: ±2µm to ±25µm - Cycle Time: 14K max - Die Size Compatibility: 0.15 x 0.15 – 10 x 10 mm (Option for 0.05 x 0.1 mm Die Size Handling) - Substrate Size Compatibility: Width 50 – 130 mm, Length 100 – 300 mm, Thickness 0.5 – 5 mm - Wafer Input: Up to 12 inches - Bonding Method: Epoxy/UV Curing 【Product Features】 - Multi-chip compatibility - Dispenser: Up to 3 units can be installed (3rd unit optional) - Multi-bond head collet, multi-pickup collet, multi-ejector, multi-input (wafer, gel pack, waffle pack, etc.) - 3D inspection function for epoxy - Suitable for small batch, diverse products, mass production, and R&D use
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Applications/Examples of results
3D Sensing、Telecom、Data Center、General LED Lightings & RGB Display、Automotive
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Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.