Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
Full automation is possible at a low cost through integration with the conveying system.
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basic information
Automatic transport system with chip inversion mechanism and automatic alignment mechanism achieving alignment accuracy of ±5μm. Ultrasonic head can be installed as an option.
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Applications/Examples of results
○ Applications and Examples of Achievements For cell production applications of small-sized LCD modules with a small quantity and a variety of types, as well as for various research and development purposes such as LD mounting, high-brightness LED mounting, and multi-pin flip chip mounting. 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Product Information http://www.welljp.co.jp/fcb.html Company Information http://www.welljp.co.jp/
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Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."