A highly integrated low-power platform with flexible and abundant connectivity and I/O accelerates the efficiency of development.
This versatile platform, equipped with the ultra-fast MediaTek Genio 1200 octa-core SoC, delivers exceptional AI, graphics, and computing performance to meet the most demanding use cases. It offers a rich array of camera and display integration options, supporting dual MIPI CSI cameras and up to three MIPI DSI, HDMI, and LVDS displays. High-speed connectivity is achieved through dual-band WiFi 6 with MU-MIMO, Bluetooth 5.2, and up to three gigabit Ethernet ports, along with a built-in SIM card slot and an optional 5G adapter.
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basic information
* Equipped with MediaTek Genio 1200 * High-performance AIoT solution * Fully customizable I/O * Optimization of software packages
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Applications/Examples of results
The VIA SOM-7000 accelerates the development of groundbreaking systems for demanding industrial, commercial, and consumer edge AI and IoT applications.
Detailed information
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The VIA SOM-7000 module can be purchased as an individual module, as well as together with the VIA VAB-7000 carrier board and the optional 5G wireless module.
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VAB-7000 Carrier Board The VIA SOM-7000 module can be purchased as an individual module, and it can also be purchased together with the VIA VAB-7000 Carrier Board and the optional 5G wireless module.
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Company information
VIA Technologies is a global leader in the development of highly integrated embedded platforms and system solutions for a wide range of M2M, IoT, and smart city applications, including video walls, digital signage, healthcare, and industrial automation. Headquartered in Taipei, Taiwan, VIA's global network connects to high-tech centers in the United States, Europe, and Asia. Its customer base includes many well-known companies in the world's leading high-tech, telecommunications, and consumer electronics industries. VIA is listed on the Taiwan Stock Exchange (TSE 2388).
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