Providing new functions through surface modification using functional group modification with plasma.

Achieving "direct plating without roughening" for difficult-to-plate resins and difficult-to-bond resins, as well as "adhesive-free direct bonding" and "improved adhesion with adhesives"!

Our company's modification technology provides surface modification treatments that cannot be achieved through conventional plasma surface treatment (such as organic material removal and temporary hydrophilicity enhancement) by firmly bonding functional groups to the substrate surface. 【Features】 ○ Non-roughening direct plating technology for low dielectric materials and difficult-to-plate materials Direct copper plating without roughening and without an intervening seed layer is possible on materials such as fluororesins, LCP, COP, and polyimide resins. ○ Non-roughening adhesive-free direct bonding technology for difficult-to-bond materials Direct bonding without the use of adhesives is possible between various fluororesins, LCP, COP, and difficult-to-bond resins, as well as between copper and aluminum. ○ Adhesive strength enhancement technology using adhesives By performing surface modification on substrates (metals, ceramics, resins), the adhesive strength of various adhesives can be improved. ○ Surface modification technology for powders - Improved dispersion and adhesion of carbon particles - Enhanced filling degree of various fillers into resins, etc.

Plasma surface treatment equipment