An industry-standard machine boasting a large number of delivery achievements! Equipped with linear array photodetectors.
The "Model3100" is an optical interference film thickness measurement device that employs linear array elements in the light-receiving sensor, enabling high-speed measurements. By standardly equipping spectral analysis software, it allows for simultaneous measurement of multilayer films (typically up to three layers) and the measurement of optical constants (n, k). It enables fine parameter settings suitable for various film characteristics, allowing for more diverse film thickness measurements of various film structures. 【Features】 ■ Capable of measuring up to 70μm equivalent to an oxide film with a high-sensitivity, high-resolution head (optional) ■ A 100x lens (with a micro spot of φ0.75μm) is also available ■ Easy implementation of program settings for special film measurements suitable for the process ■ Supports various applications (magnetic heads, FPD, material research, etc.) and allows for the creation of sample stages tailored to specific uses (optional) *For more details, please refer to the PDF materials or feel free to contact us.
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【Basic Specifications (Excerpt)】 <Model: 3100 (Standard Head)> ■ Measurement Program: Capable of measuring multilayer films (typically up to 3 layers) regardless of substrate material ■ Measurement Wavelength Range: 380–800 nm ■ Film Thickness Measurement Range: 100 Å–30 μm (dependent on film thickness) ■ Measurement Reproducibility: 2 Å (1σ for 15 measurements at the same point) *dependent on film thickness ■ Measurement Time: 0.1–25 seconds per point ■ Objective Lens (Spot Size): 5x (φ50 μm) ■ Objective Lens Options: 10x (φ25 μm), 50x (φ5 μm) ■ Device Configuration: Visible light, holographic concave diffraction grating, linear array element *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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We handle various inspection and analysis equipment, including new and used devices. (Fully automatic XPS film thickness concentration measurement device, overlay accuracy measurement device, double-sided coordinate measurement device, film thickness measurement device, ellipsometer, optical three-dimensional measurement device, wafer edge inspection device, transparent wafer front and back defect inspection device, appearance inspection device, optical microscope, exposure device)
