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  6. [Recommended Example] Bandria Terminal <Replacement from Stamped Parts>

[Recommended Example] Bandria Terminal <Replacement from Stamped Parts>

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last updated:Mar 27, 2024

ファインネクス 本社、東京支店、大阪支店、名古屋支店、ベトナム工場、シンガポール営業所
ファインネクス 本社、東京支店、大阪支店、名古屋支店、ベトナム工場、シンガポール営業所
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Proposal to reduce the initial costs of molds! It is possible to secure plating on all four sides of the terminal.

We would like to introduce a case study regarding the replacement of pressed parts with Bandria terminals that we conducted. The pressed terminals made from hoop material require significant initial mold investment, and expensive molds are needed every time there is a dimensional change. In the case of wire material, adjustments to the overall length do not require molds, allowing for dimensional changes with only adjustments to the feed amount. Additionally, various processing options such as taper shapes at the tip and crushing of the press-fit section are available. [Challenges] - Pressed terminals require significant initial mold investment, and expensive molds are needed for every dimensional change. - Conventional pressing processes generate a large amount of metal scrap outside of the product area. - Pressed products expose the raw edges of the punched side, necessitating post-plating if plating on the sides is required. - High pressure during punching can cause distortion in the processed terminal shapes. *For more details, please refer to the related links or feel free to contact us.*

    Other moldsProcessing Contract
バンドリア端子.jpg

[Recommended Example] Bandria Terminal <Replacement from Stamped Parts>

バンドリア端子.jpg
バンドリア端子.jpg
  • Related Link - https://www.finecs.co.jp/case/

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basic information

【Results】 ■Reduction of initial costs for molds ■Reduction of material waste ■Ensuring plating on all four sides of the terminal ■Stabilization of terminal cross-sectional shape *For more details, please refer to the related links or feel free to contact us.

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ファインネクス

ファインネクス 本社、東京支店、大阪支店、名古屋支店、ベトナム工場、シンガポール営業所

Electronic Components and Semiconductors

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Through years of accumulated expertise in the plastic processing technology of wire materials, we are capable of producing a wide range of products, from micro pins with a wire diameter of φ100μm or less to large forged parts for automobiles, all through header forging processing. With over 2,000 in-house processing machines, we have established a mass production system for some of the world's leading forged components. For PGA terminals used in CPUs for personal computers, where we have achieved a top global market share, we supply over 10 billion units monthly, contributing to the advancement of the IT society. Leveraging our know-how in forging processing, we respond to the needs of customers across various fields, including consumer goods, automotive, and medical applications. Additionally, we possess a consistent manufacturing line that extends from forging processing to plating, press processing, insert molding, and assembly of components, allowing us to provide parts with higher added value by combining various processing methods, not just limited to forging. We also cater to a wide range of needs, including OEM assembly of high-quality parts such as automotive sensor components and other vehicle parts that require stringent quality standards.

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