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  6. Flexible and high thermal conductivity liquid epoxy resin series (room temperature curing and heat curing)

Flexible and high thermal conductivity liquid epoxy resin series (room temperature curing and heat curing)

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last updated:Sep 24, 2024

寺田
寺田
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Flexible high thermal conductivity (high thermal conductivity) resin with thermal conductivity ranging from 0.9 to 2.8 W/m·K! We have a lineup of four products available for room temperature curing and heat curing!

In recent years, with the miniaturization and high integration of components, there has been a demand for thermally conductive epoxy resins as insulating materials, and stress relief has also become necessary. In response to this need, we have developed a flexible thermal conductive resin series. This product series features low viscosity for ease of use and has thermal conductivity ranging from 0.9 to 2.8 W/m·K. In addition to the conventional heat-curing type, we also offer an environmentally friendly room-temperature curing type. Both types are two-component systems. We also have products that are non-flexible but offer higher thermal conductivity. For more details, please download the PDF "Introduction to TERADITE [Updated on 2024/8/1]" from the link below or check the product page. https://www.ipros.jp/product/detail/2001118658 *For product details, please download the PDF from the link below or feel free to contact us. *On 2024/8/1, the PDF for TE-7172 was replaced with the improved model number TE-7172K. *On 2024/9/24, the PDF for TE-7170 was replaced with the improved model number TE-7170K.

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柔軟1.png

Flexible and high thermal conductivity liquid epoxy resin series (room temperature curing and heat curing)

柔軟1.png
柔軟1.png IPROS87489559172950448823.jpeg IPROS24215939675983459919.jpeg IPROS74615738417257252247.png 柔軟2.jpg 柔軟3.jpg 柔軟4.jpg
  • Special site - Product/service details - https://pr.mono.ipros.com/trd/product/

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Lineup ■TE-717K: 0.9W/m·K, room temperature curing, flexibility ■TE-7171: 1/2W/m·K, heat curing, flexibility ■TE-7172K: 1.5W/m·K, room temperature curing, flexibility ■TE-7173: 2.8W/m·K, heat curing, flexibility

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Applications/Examples of results

Heat dissipation components that require stress relaxation, such as motors, reactors, electronic substrates, and batteries.

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List of Flexible Heat-Resistant Resins

List of Flexible Heat-Resistant Resins

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TE-7170K Room Temperature Curing 0.9W Flexible Resin

TE-7170K Room Temperature Curing 0.9W Flexible Resin

TECHNICAL
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TE-7171 Heating Hardening 1W Flexible Resin

TE-7171 Heating Hardening 1W Flexible Resin

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TE-7172K Room Temperature Curing 1.5W Flexible Resin

TE-7172K Room Temperature Curing 1.5W Flexible Resin

TECHNICAL
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TE-7173 Heat-Cured 2.8W Flexible Resin

TE-7173 Heat-Cured 2.8W Flexible Resin

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[Updated on 2024/8/1] Introduction to TERADITE

[Updated on 2024/8/1] Introduction to TERADITE

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Terada Co., Ltd. - Company Profile

Terada Co., Ltd. - Company Profile

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News about this product(1)

Flexible and high thermal conductivity liquid epoxy resin series (room temperature curing and heat curing)

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We have developed a product that imparts flexibility to high thermal conductivity (high heat dissipation) resin. We offer four product variations that cure at room temperature and through heating. For more details, please see the related products below.

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寺田

寺田

Electronic Components and Semiconductors

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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.

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