High-reliability adhesive for power modules
Automotive Adhesive Micromax "DA510" We handle pressure-type silver sintering bonding materials for high-reliability die attach and die top materials for SiC and GaN power semiconductors. DA510 is an adhesive that can be stored at room temperature and has excellent printability. It features a dense sintering surface achieved in a short time of 10 to 15 minutes at 250 to 280°C. Please feel free to contact us when you need assistance. 【Features】 ■ Silver sintering bonding material suitable for high-temperature operating power modules ■ High stability at room temperature allows for long continuous printing ■ Pressure-type bonding material enables short sintering times ■ Can be stored at room temperature *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■Composition: Silver solder ■Lead: Lead-free ■Low resistivity (μΩ·cm): <4.5 ■Substrate: Gold, silver, copper ■Profile ・250-280℃ ・≧10MPa ・1-15 minutes *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
Company information
As a pioneer in thick film paste manufacturing, we have been handling over 800 types of pastes, inks, glass ceramic tapes (green tapes) for more than 60 years. Focusing on thick film resistor materials for passive components, we provide a wide range of circuit formation materials for various applications, including automotive (TIM materials for power modules and IME materials for human-machine interfaces), telecom (materials for 5G communication and high-frequency transmission and reception modules), home appliances, and healthcare (printed electronics materials for biosensors, smart clothing, and wearable sensors). Please feel free to contact us if you have any inquiries.
