Apply a thin layer, let it dry, and then join later! A new thin film bonding process.
Kisou Corporation will exhibit at the "New Aichi Creative Research and Development Exhibition 2026" within the "AXIA EXPO 2026" held at Aichi Sky Expo (Aichi Prefectural International Exhibition Center). Our "CAM Adhesive" is not an adhesive but an ultra-thin surface treatment film that provides joining functionality. The coated and dried components can be heated and pressed in subsequent processes. Please check the actual samples and performance at the exhibition. Feel free to consult us about joining conditions and applications. 【Product Features】 ■ High-strength bonding of approximately 10MPa ■ Resistant to heat and humidity environments ■ Contributes to cost reduction ■ Transparent and insulating *For more details, please download the PDF or feel free to contact us.
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【Exhibition Overview】 ■ Dates: June 3 (Wed) to June 5 (Fri), 2026, 10:00 AM to 5:00 PM ■ Venue: Aichi Sky Expo [Aichi Prefectural International Exhibition Center] ■ Booth Number: S-16 ■ Address: 5-10-1 Centrair, Tokoname City, Aichi Prefecture, 479-0881 ■ Admission Fee: 1,000 yen * Free for registered attendees, those with invitations, and middle school students and younger * For more details, please download the PDF or feel free to contact us.
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【Product Applications】 ■ Joining of dissimilar materials such as steel/copper and aluminum/copper, mounting of power devices like SiC and GaN, low thermal resistance bonding, high thermal conductivity materials, laminated bonding, and improvement of dimensional accuracy. *For more details, please download the PDF or feel free to contact us.
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Our company is engaged in the development of joining technologies. The newly developed CAM joining can handle a range of applications, starting from the joining of dissimilar materials such as metal and resin, to metal-metal joining that includes dissimilar metals. CAM joining can achieve zero thermal resistance and is also applicable to the laminated joining of multilayer thin plates.
