Maintains stable performance even in low output areas! Suitable for cleaning delicate parts.
We propose a "high-frequency cleaning unit" for semiconductor manufacturing processes. Many customers using sputtering equipment or CVD equipment may be requesting the regeneration of fixtures from manufacturers. In specific cases, ultrasonic cleaning can cause damage to parts. Our ultrasonic technology maintains stable performance even at low output levels, making it suitable for cleaning delicate components. We assist in improving cleaning quality by utilizing various frequencies of ultrasound to recover more precious metals, such as gold, while simultaneously enhancing the cleanliness of fixtures and completely removing metal ions. [Features] - Achieves uniform power distribution within large cleaning tanks, which are often required. - Optimizes cleaning power with a wide range of output adjustments. *For more details, please refer to the PDF materials or feel free to contact us.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.