Trends in flux cleaning due to miniaturization! Introducing technical points in fine bonding products.
Electronics assembly refers to the technology of mounting electronic components onto a substrate. Specifically, it involves the process of joining components such as semiconductors, resistors, and capacitors to a printed circuit board to form an electrical circuit. The sizes of these components tend to become smaller in response to the demands for higher performance and space-saving in products, and accordingly, fine joining technologies are also evolving. This has a significant impact on the cleaning processes as well. We will explain the evolution of joining technologies and cleaning in fine joining. *For detailed content of the article, you can view it through the related links. For more information, please download the PDF or feel free to contact us.*
Inquire About This Product
basic information
*You can view the detailed content of the article through the related link. For more information, please download the PDF or feel free to contact us.*
Price range
Delivery Time
Applications/Examples of results
*You can view the detailed content of the article through the related link. For more information, please download the PDF or feel free to contact us.*
catalog（1）
Download All Catalogs![Cleaning Technology for Advanced Electronic Components: Mechanisms and Evaluation Methods for Residual Contamination [Materials]](https://image.mono.ipros.com/public/catalog/image/01/8b3/743796/IPROS44265245693872697115.jpeg?w=120&h=170)
News about this product（1）
Company information
Zestron is a global standard "flux cleaning agent manufacturer" based in Germany, with eight locations worldwide. Our cleaning agents are primarily environmentally friendly water-based cleaners that achieve a balance between cleaning performance and safety, while also enabling the reduction of organic solvents, VOCs, and overall usage to lower costs. At our technical center in Kanagawa, customers can choose from inline and batch-type spray cleaning equipment, as well as jet and ultrasonic devices, tailored to their needs, allowing them to test work cleaning under conditions equivalent to those in production environments. In parallel with the cleaning tests, we analyze cleanliness at our analysis center. Utilizing digital microscopes, FT-IR, ion chromatography, and SEM-EDX/EDS, we can detect flux residues that are often overlooked by visual inspection. After the tests are completed, our engineers will provide a technical report detailing recommended processes. *We generally offer support for cleaning process issues free of charge. If you have any requests or challenges related to flux cleaning, please feel free to contact us.
![Exploring the Current State of Solder Cleaning - The Evolution of Solder and Cleaning - [Technical Document Download]](https://image.mono.ipros.com/public/product/image/e88/2001029484/IPROS8944161682852368377.jpg?w=280&h=280)
![Why is cleaning necessary for sintering bonding? [Cleaning issues in sintering bonding]](https://image.mono.ipros.com/public/product/image/5b0/2001139358/IPROS15805760250461693867.png?w=280&h=280)
