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  6. Ultra High Precision Bonder FDB210P

Ultra High Precision Bonder FDB210P

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FDB210P

last updated:Jul 22, 2024

澁谷工業 メカトロ統轄本部
澁谷工業 メカトロ統轄本部
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It is a super high-precision die bonder optimized for mass production of optical devices.

This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip mounting. It enables ultra-high-precision mounting of microchips on supplied substrates using a two-point recognition method. It is a compact device that integrates chip/substrate supply and finished product storage. Shibuya Kogyo has many years of experience in optical communication modules and optical devices. The FDB210P is one of the devices that incorporates years of know-how.

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Ultra High Precision Bonder FDB210P

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  • Related Link - https://www.shibuya.co.jp/
  • Special site - Product/service details - https://pr.mono.ipros.com/shibuya/product/

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basic information

Main Features ■ Compatible with microchips (0.25 mm and above) (Option: 0.15 mm and above) ■ High precision mounting achievable at ±0.7 μm (3σ) High precision positioning is realized through a high-rigidity frame and fully closed-axis control, along with an automatic calibration function that ensures stable mounting accuracy. ■ Supports various processes Broad compatibility with processes such as eutectic bonding and resin bonding, equipped with monitoring functions post-mounting, making process control easy. Options ■ Ultrasonic head ■ Multi-chip support ■ N₂ purge mechanism ■ Face-up mounting capability

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Applications/Examples of results

High-precision die bonder High-precision flip chip bonder For COC and COS process implementation in optical device and laser module manufacturing Supports eutectic bonding, resin bonding, and more

Company information

澁谷工業

澁谷工業 メカトロ統轄本部

Other manufacturing

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Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (such as taping machines, multifunctional test handlers, ball mount machines, and bonders). Please feel free to contact us if you have any inquiries.

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