Electrostatic prevention and electrical conductive filler, rod-shaped particles, conductivity, zinc oxide.
Forming an electrical conduction path with a high aspect ratio shape improves antistatic properties! The rounded surface shape is characterized by good fillability with resins and other materials.
Static electricity occurs in familiar places in our lives and can occasionally cause significant problems in manufacturing sites and precision equipment. One countermeasure is the addition of antistatic fillers. Zinc oxide, by doping aluminum (AZO), can reduce the volume resistivity of the powder to about 200Ω·cm and is widely used as an antistatic filler. It has the following advantages over ATO (antimony-doped tin oxide) antistatic fillers: - Lower Mohs hardness than tin oxide, resulting in lower aggressiveness towards manufacturing equipment - Environmentally friendly as it does not contain Sb (antimony), making it safe for humans and the environment - Lower whiteness (gray), making it easier to maintain dark color designs Our company has successfully developed rod-shaped conductive zinc oxide using our unique particle synthesis technology. The rod-shaped zinc oxide is expected to have the following three effectivenesses: 1. Its high aspect ratio makes it easy to form electrical conduction paths. 2. Its rounded corners, due to the crystal structure, make it easy to fill into resins and other materials. 3. By changing the type of doped elements, it is possible to further reduce the volume resistivity. If you have any requests for samples or questions, please feel free to contact us.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.
