Semiconductor device failure analysis solution

In the dry etching process, precise exposure of the insulating layer and metal layer is possible!

The "Corial Shuttleline Series for Failure Analysis" is a failure analysis device capable of selectively removing not only the insulating layers of semiconductor ICs but also the metal layers. It features a small footprint and is a cost-effective failure analysis system. To maintain electrical characteristics, it provides highly precise etching processes using RIE and ICP-RIE, ranging from multi-level deprocessing that does not etch the metal layers to damage-free processes with high selectivity, including metal etching. The failure analysis solution can analyze die packages and full wafers up to 200mm. 【Features】 ■ Does not etch metal layers to maintain electrical characteristics ■ High selectivity processes including metal etching from multi-level deprocessing ■ Reduces analysis time from 1 to 5 days with wet etching to just 1 to 2 hours *For more details, please feel free to contact us.

Other analyses