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  6. Exhibition materials are here! Fujimi nanotech2025

Exhibition materials are here! Fujimi nanotech2025

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last updated:May 18, 2026

フジミインコーポレーテッド
フジミインコーポレーテッド
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Download the exhibition materials for nanotech2025 here.

Thank you for visiting our booth at the nanotech2025 exhibition. At our booth, we showcased new powders utilizing foundational technologies developed from abrasives, including: - Rod-shaped zinc oxide - Titanium phosphate - α-type SiC (silicon carbide) powder - Thermal spray materials - Alumina materials - Ultra-hard materials for additive manufacturing Were there any exhibits related to your company’s field? In addition to the items displayed this time, we have various technologies and products. If your company or industry has any challenges, we would be grateful if you could consult with us. Additionally, a catalog of the exhibited products is available for download below, so please feel free to use it for circulation and other purposes. We hope these products can assist in solving your company’s challenges. If you have any products of interest, please do not hesitate to contact us.

    Other polymer materials
nano25_banner_330-250_ja.jpg

Exhibition materials are here! Fujimi nanotech2025

nano25_banner_330-250_ja.jpg
nano25_banner_330-250_ja.jpg 丸み状炭化ケイ素_イプロス用サムネイル.png 酸化亜鉛_イプロス用サムネイル.png 3Dプリンタ向け超硬粉末_イプロス用サムネイル.png リン酸チタン_イプロス用サムネイル.png GC#40000_イプロス用サムネイル.png
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catalog(13)

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【NEW】Heat dissipation and thermal conduction filler - rounded silicon carbide (SiC) / contributes to high filling and high fluidity.

【NEW】Heat dissipation and thermal conduction filler - rounded silicon carbide (SiC) / contributes to high filling and high fluidity.

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Introduction of rod-shaped zinc oxide for heat dissipation and thermal conductivity filler.

Introduction of rod-shaped zinc oxide for heat dissipation and thermal conductivity filler.

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Introduction of conductive round bar-shaped zinc oxide - antistatic and electrical conductive filler.

Introduction of conductive round bar-shaped zinc oxide - antistatic and electrical conductive filler.

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Introduction of 250nm SiC particles GC#40000 for high-density sintered bodies / Silicon Carbide

Introduction of 250nm SiC particles GC#40000 for high-density sintered bodies / Silicon Carbide

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Introduction of a new proposal for solid lubricant: Plate-shaped titanium phosphate.

Introduction of a new proposal for solid lubricant: Plate-shaped titanium phosphate.

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Introduction of white plate-like particles of titanium phosphate / solid lubricant, optical filler

Introduction of white plate-like particles of titanium phosphate / solid lubricant, optical filler

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Introducing a 3D printer ultra-hard powder that achieves a hardness equivalent to HRA92! This is a presentation of a molded body made using a newly developed WC-TiC-Co based powder for additive manufacturing.

Introducing a 3D printer ultra-hard powder that achieves a hardness equivalent to HRA92! This is a presentation of a molded body made using a newly developed WC-TiC-Co based powder for additive manufacturing.

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Introduction of ultra-hard alloy powder developed for 3D printers.

Introduction of ultra-hard alloy powder developed for 3D printers.

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List of products for thermal spraying powders

List of products for thermal spraying powders

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Introduction to the powder for thermal spraying provided by our company.

Introduction to the powder for thermal spraying provided by our company.

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Nano-submicron particle manufacturing technology

Nano-submicron particle manufacturing technology

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Plate-shaped alumina particles_PWA

Plate-shaped alumina particles_PWA

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White fused alumina particles WA

White fused alumina particles WA

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フジミインコーポレーテッド

フジミインコーポレーテッド

Electronic Components and Semiconductors

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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.

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