Seminar held at the Implementation and Assembly Process Technology Exhibition 2024 in Kumamoto! We will introduce methods for defect analysis using X-rays and methods for identifying the causes of defects.
At the exhibition "Assembly and Mounting Process Technology Exhibition 2024 in Kumamoto," organized by 19 manufacturers of mounting equipment and post-mounting process manufacturers, we will hold a free seminar on "Analysis Methods for Defective Boards Using X-ray Equipment." In this seminar, we will introduce X-ray inspection methods, analysis methods for defects using X-rays, and ways to identify the causes of defects. We will also cover defect cases such as "defects caused by bubbles in inner layer vias" and "defects caused by cracks in board through-holes." We look forward to your attendance. 【Event Overview】 ■ Date and Time - November 28, 2024 (Thursday) 15:00 - 16:00 - November 29, 2024 (Friday) 10:15 - 11:15 ■ Venue: Gran Messe Kumamoto Conference Room ■ Address: 1010 Fukutomi, Mashiki Town, Kamimashiki District, Kumamoto Prefecture ■ Participation Fee: Free *For more details, please download the PDF or feel free to contact us.
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Seminar Content: MUSUBI Exhibiting Manufacturers Implementation Technology/Subsidy Special Seminar ■ Aibit Co., Ltd. "Analysis Methods for Defective Boards Using X-ray Equipment" Approximately 60 minutes Speaker: Keisuke Mukaiyama, Representative of Aibit Content: This seminar will discuss methods for analyzing defective cases of mounted boards using X-ray equipment, as the defect shapes vary with each case. By analyzing defective boards with X-ray images, there are many instances where the cause of the defects can be identified. We would like to introduce the latest X-ray inspection techniques, methods for defect analysis using X-rays, and ways to identify the causes of defects. Defective cases to be covered: (1) Defects caused by bubbles in inner layer vias of the board (normal operation when BGA is pressed from above) (2) Defects due to cracks in board through-holes (cracks occur due to thermal expansion in the furnace, leading to defects when removed from the furnace, thought to be mounting defects) (3) "Cushion solder defects" due to component warping and board warping (warping caused by thermal expansion in the furnace) (4) Defects in via filling causing blowout defects from vias during furnace heating (thermal expansion of vias) (5) Defects due to differences in area ratio at the junction between BGA and the board (cracks occur on the side with a smaller connection area when the balls expand due to driving heat)
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For more details, please download the PDF or feel free to contact us.
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The "i" in i-Bit represents intelligence (information), image (visuals, images), and other types of information that we receive on a daily basis. Bit refers to the numbers used in binary code, specifically "0" and "1," which are units processed by computers. We aim to contribute to society by receiving i and using Bit.
