Achieving lightweight dicing frames!
We have developed a lightweight "IT Dicing Frame"! This product is a frame used in the dicing process (cutting process) of semiconductor wafers, supporting precise processing by securing the wafer. Compared to the conventional SUS frame weighing 300g (t=1.5mm), we have achieved a significant weight reduction to just 85g (t=2.0mm). This contributes to reducing the burden during transportation and lowering the load on equipment, thereby supporting work efficiency. If you are interested, please feel free to contact us. We also welcome inquiries for quotes. Please consult us regarding the provision of sample products!
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basic information
【Specifications】 ◇Dimensions: 12 inches ◇Thickness: 2mm ◇Weight: 85g ◇Flatness: 0.3mm or less
Price range
Delivery Time
Applications/Examples of results
Currently under evaluation by semiconductor manufacturing companies.
Company information
Togo Sangyo Co., Ltd. enhances its corporate value not only through the continuous practice of corporate governance and compliance in the sales business of steel materials, resin materials, electrical and electronic components, and production equipment for automobiles, home appliances, and consumer goods, but also through activities aimed at improving customer satisfaction and preserving the global environment. Additionally, we contribute to society by complying with laws and regulations and providing support to our suppliers and customers.
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