A socket that can be used under the same conditions as implementation without soldering IC devices, "Solderless."
It is a socket that allows for the replacement of ICs without mounting them on the board, useful for evaluating BGA and LGA devices, especially during the prototyping stage.
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basic information
■Product Overview Socket body size: Device height + 3mm X width + 10mm (for devices with a size of 15mm or more) Body material: Thermoplastic / Liquid Crystal Polymer (varies by pitch) Base socket material: FR-4 Glass Epoxy (UL94V-0) ■Types: ●Flip Top Socket Pitch: 0.5mm / 1.00mm / 1.27mm Additionally, custom specification sockets are available. Please consult for details. ■Features: After mounting a base socket the same size as the device, simply insert the socket body into the circuit board. By placing the device in the body, closing the lid, and lightly tightening the screws, contact can be made. Contact pogo pins (spring pins) are arranged with the same footprint as the device's solder balls (pads), ensuring high contact reliability. ■Production Lead Time 4-8 weeks Varies depending on device specifications. Please inquire for details.
Price information
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Price range
P3
Delivery Time
※The delivery time will vary depending on the proposed socket.
Applications/Examples of results
BGA device 1936 pins (supports up to 2000 pins) LGA device 35x35mm 900 pins (supports up to 2000 pins) For prototypes and evaluation boards.
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Company information
Import and sales of BGA sockets, PGA sockets, various connectors, floating connectors, MXM connectors, RJ45, board-to-board connectors, D-sub, SODIMM DDR4 sockets, SATA, pin headers, battery holders, and LEDs. The service for modification and alteration of electronic boards has been transferred to our subsidiary, Kaz Ship Co., Ltd. Handling manufacturers: Memory Protection Devices (Battery holders) XFMRS (RJ45 connectors, common mode chokes) Advanced Interconnections (IC sockets, custom connectors) LOTES (CPU sockets, RJ45 connectors) Neltron Industrial (M.5 waterproof cables)
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