[Seminar] Waterproof Design [Beginner] - Waterproof Structures and Design in Electronic Devices -
For beginners and young professionals! Learn the basics of waterproof design in just 3 hours, addressing challenges in design, rigidity, and heat dissipation to take development to the next stage.
To young designers, those who are about to start structural design, and all engineers who want to reaffirm their knowledge of waterproof design. The addition of waterproof functions to electronic devices, including smartphones, has become common. On the other hand, are you facing new challenges such as "increased component costs," "design constraints," and "reduced casing rigidity and heat dissipation"? This seminar is an introductory course that systematically teaches the basic knowledge and fundamental techniques of waterproof design in three hours. We will specifically explain the basics of waterproof structures common across products, using components like O-rings and screws, along with manufacturer-provided materials. Furthermore, we will propose a review of the traditional evaluation flow and a shift to front-loading development utilizing CAE. We will provide hints that can lead to improvements in the development process. No prior knowledge is particularly required, so please feel free to participate.
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1. Company Introduction 2. Electronic Devices and Waterproof Standards 2-1. Electronic Devices and Waterproofing 2-2. What are Waterproof Standards (Dustproof Standards)? 3. Key Points of Waterproof Design 3-1. Classification of Waterproof Function Addition Methods 3-2. Product Cost Control 3-3. Design Constraints 3-4. Challenges of Enclosure Rigidity 3-5. Decreased Heat Dissipation Characteristics due to Sealed Enclosures 4. Waterproof Design by Component 4-1(1). Waterproof Design of Cases: Basics of Waterproof Structure, Insert Molding, etc. 4-1(2). O-Ring and Rubber Packing (Gasket) Design 4-1(3). Waterproof Design Using Double-Sided Tape for Various Parts 4-1(4). Waterproof Design of Screws 4-2(1). Waterproof Design of Display and Operation Parts 4-2(2). Waterproof Design of Acoustic Components 4-2(3). Waterproof Design of Connectors/External Interfaces 4-2(4). Waterproofing of Circuit Boards 4-2(5). Heat Dissipation Design of Waterproof Enclosures 5. Evaluation of Waterproof Function 5-1. How to Conduct Waterproof Testing and Evaluation 5-2. Identifying Causes and Implementing Countermeasures 6. Development Process of Waterproof Devices 6-1. Development and Design Methods (Utilization of CAE) 6-2. Establishment of Design Standards
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You can systematically acquire the fundamentals of waterproof design. It covers everything from basic knowledge of waterproof and dustproof standards to the fundamentals of specific waterproofing methods, allowing even young or non-specialist designers to systematically understand the overall picture of waterproof design. No prior knowledge is particularly required. You can learn practical solutions to challenges. You will learn specific countermeasures and points regarding challenges that designers often face, such as increased costs associated with waterproof design, design constraints, chassis rigidity, and reduced heat dissipation characteristics. This will help reduce rework in the development field and enable higher quality product design. You will gain tips to improve development efficiency. By understanding the overview of the development method called front-loading utilizing CAE, you can break away from traditional evaluation methods and learn an efficient approach to identify issues in the early stages of development. This contributes not only to individual skill enhancement but also to improving the development capabilities of the organization you belong to.
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A Challenge to Transform "Impossible" into "Possible" in Design Quality One day, we received a development project for a new wearable device that pursued unprecedented thinness and lightness. The client's request was, "It must be completely waterproof while not compromising on design at all." The project initially ran aground due to this conflicting challenge. The thickness of the casing was just a few millimeters. With conventional waterproofing technology, it was not only difficult to protect the internal precision instruments but also to maintain design integrity. While many engineers threw in the towel, declaring it "impossible," the challenge at Kamigami Corporation began. Our team first thoroughly utilized 3D data as part of our DX promotion, repeatedly conducting simulations in a virtual space. This was a crucial process to eliminate rework and improve development productivity. Drawing on the experience and insights that our representative, Suzuki, had cultivated over many years in developing some of the world's thinnest waterproof designs for smartphones, we meticulously analyzed every possible water intrusion route, leaving no 0.1 millimeter gap unchecked. We pursued the highest design quality and devised a new waterproof structure that overturned conventional wisdom.
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