Film formation processing contract service

basic information

We will propose the optimal method according to your requests. 1. Target base materials (substrates) Various films Various resin sheets Various wafers Various glasses Ceramics Various metals 2. Types of films Metals (Cu, Al, Cr, Ni, Sn, Ti, Ta, W, Zn, Ag, Au, Pd, Pt, etc.) Oxide films (ITO, Al2O3, SiO2, SiO, TiO2, MgO, etc.) Nitride films (AlN, BN, SiN, TiN, etc.) Carbide films (SiC, TiC, etc.) Organic compounds (PI, PA, PE, etc.) 3. Film formation methods Sputtering method Vapor deposition method CVD method (Plasma CVD (PE-CVD), LP-CVD) Coating method (dip coat, spin coat, spray coat) Plating method (electroless plating, electroplating)

Price information

Sartec's film deposition processing specializes not only in standalone contract services but also in providing integrated solutions that combine the design of FPCs (flexible printed circuits) and electronic component mounting. We offer proposals from the perspective of "product development aimed at completion" for customers facing challenges such as "the film deposition was successful, but there were issues in the next process" or "I can't find a partner to transition from the prototype stage to mass production." #FilmDeposition, #Sputtering, #Evaporation, #CVD, #Plasma, #Coating, #ElectrolessPlating, #RollToRoll, #Wafer, #Glass

Delivery Time

Applications/Examples of results

■Regarding R to R Support With R to R (Roll-to-Roll) support, continuous and highly efficient film deposition processing is achieved for film-like materials. This enables a smooth transition from prototyping to mass production processes, balancing development speed and cost performance. For details regarding the target base materials, types of film deposition, methods of deposition, etc., please contact us. #Film Deposition, #Sputtering, #Evaporation, #CVD, #Plasma, #Coating, #Plating, #Electroless Plating, #Electroplating, #Roll-to-Roll, #Wafer, #Glass, #Ceramics #Cu, #Al, #Cr, #Ni, #Sn, #Ti, #Ta, #W, #Zn, #Ag, #Au, #Pd, #Pt, #ITO, #Al2O3, #SiO2, #SiO, #TiO2, #MgO, #AlN, #BN, #SiN, #TiN, #SiC, #TiC, #PI, #PA, #PE #Film Deposition, #Sputtering, #Evaporation, #CVD, #Plasma, #Coating, #Electroless Plating, #Roll-to-Roll, #Wafer, #Glass, #Ceramics