We provide reliable dicing tape frames essential for semiconductor manufacturing.

We also accommodate various special-shaped dicing tape frames in different sizes!

Our company manufactures and sells the essential "Dicing Tape Frame" used in the dicing process. It supports precise cutting and transportation of wafers, achieving high reliability and stability, especially during overseas shipments. Our high-quality frames are adopted in a wide range of fields, including semiconductor manufacturing companies, precision glass processing manufacturers, and research and development institutions. In addition to providing new products, we are also focusing on reuse options such as "regrinding" and "replating," contributing to reduced environmental impact and cost optimization. Furthermore, we offer "laser engraving services" for lot numbers and manufacturing information, which also enhances traceability. 【Specifications】 ■Material: SUS420-J2 (can be made from other materials) ■Hardness: HRC47 or higher (non-heat-treated options available) ■Surface: Electroless nickel plating (non-plated options available) ■Flatness: 0.3mm or less ■Surface roughness: Ra0.3μm or less We propose optimal products and services for companies engaged in dicing processing and contract processing, both domestically and internationally. *For more details, please download the PDF or feel free to contact us.

Other semiconductors