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  6. High Current Connector Electrification PowerWize BMI Connector

High Current Connector Electrification PowerWize BMI Connector

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last updated:Mar 26, 2026

レスター 本社
レスター 本社
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Additional board maintenance is possible! Ensures minimization of contact resistance between the wire and crimp barrel.

The "PowerWize BMI Connector" utilizes Molex's COEUR socket technology to achieve high current transmission through right-angle/vertical headers. It features a blind-mating design available in three sizes: 3.40 millimeters (75.0A), 6.00 millimeters (110.0A), and 8.00 millimeters (185.0A), allowing for reliable connections even in hard-to-see, tight spaces. The 8.00 millimeter connector offers a vertical header option. 【Features】 ■ Provides an option to connect vertical headers and panel mount receptacles as needed ■ Allows for +/-2.00 millimeter radial float in panel mount receptacles to mitigate tolerance stacking issues ■ Supports correct orientation for right-angle headers when mounted on printed circuit boards or busbars *For more details, please download the PDF or feel free to contact us.

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PowerWize

High Current Connector Electrification PowerWize BMI Connector

PowerWize BMIコネクター1.png
PowerWize BMIコネクター1.png PowerWize BMIコネクター2.png PowerWize BMIコネクター3.png
  • Related Link - https://www.restar-ele.com/business/electronic/mol…
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【Other Features】 ■ Provides terminal back-out guarantee ■ Low contact resistance, minimal voltage drop, and reduced heat generation at contact surfaces ■ Ensures receptacle is installed in the correct orientation ■ Offers options for attaching pins to various substrates, enhancing design and manufacturing flexibility ■ Prevents mismatching of receptacles and headers ■ Provides design and manufacturing flexibility *For more details, please download the PDF or feel free to contact us.

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PowerWize BMI Connector

PowerWize BMI Connector

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

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"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

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レスター

レスター 本社

Electronic Components and Semiconductors

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Lester Corporation supports the manufacturing of electronics that underpin our daily lives through a variety of services, including the handling of semiconductors and electronic components. Additionally, as a system supplier for electronic devices, we propose optimal solutions across a wide range of fields such as broadcasting, video production, local governments, schools, and healthcare. Furthermore, amid growing concerns about global environmental issues like global warming, we contribute to reducing the environmental burden and realizing a sustainable society through business activities such as the deployment of mega-solar projects and the provision of energy management services.

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