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  6. 【NEW】HRA92 equivalent high hardness cemented carbide powder for layered manufacturing.

【NEW】HRA92 equivalent high hardness cemented carbide powder for layered manufacturing.

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WC-TiC-Co based ultra-hard alloy powder

last updated:Sep 08, 2025

フジミインコーポレーテッド
フジミインコーポレーテッド
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Achieving high hardness equivalent to HRA92 with a 3D printer! Introducing a molded body made using newly developed WC-TiC-Co based powder for additive manufacturing.

Until now, our high-hardness powder for 3D printers has had a hardness limit of around 87HRA for the molded body, which posed challenges in applications for parts made from some ultra-hard alloys due to insufficient hardness. The newly developed hard powder has a main phase of WC-TiC-Co, and by achieving a fine microstructure, we have significantly improved the hardness of the molded body to 92HRA. This enables 3D printing of ultra-hard alloy powders that require high hardness, contributing to the resolution of conventional challenges. **Expected Applications** - High-precision press molds (extended lifespan and stabilized precision) - Special cutting tools (high wear resistance and high reliability) - Prototype manufacturing (shortened delivery times) Furthermore, since we possess metal 3D printer equipment, we can provide a comprehensive service that goes beyond mere powder sales, including ultra-hard molding tests, material property evaluations, and prototype support. For customers looking for "ultra-hard alloy 3D printing," "hard powder for metal 3D printers," or "ultra-hard powder materials," we offer a total solution that combines materials, molding, and evaluation. Please feel free to contact us for inquiries about the introduction of next-generation ultra-hard alloy 3D printing or prototype consultations.

    Ceramics3D Printer
WCTiCCO_3D超硬粉末_イプロス用サムネイル.png

【NEW】HRA92 equivalent high hardness cemented carbide powder for layered manufacturing.

WCTiCCO_3D超硬粉末_イプロス用サムネイル.png
WCTiCCO_3D超硬粉末_イプロス用サムネイル.png 3D超硬粉末_イプロス用サムネイル(サブ3).png 3D超硬粉末_イプロス用サムネイル(サブ1).png 3D超硬粉末_イプロス用サムネイル(サブ2).png
  • Company website: 'Cemented carbide powder for additive manufacturing'
  • Special site - Product/service details - https://pr.mono.ipros.com/fujimiinc/product/

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【Expected Applications】 - High-precision press molds (extended lifespan and stabilized accuracy) - Special cutting tools (high wear resistance and high reliability) - Prototype manufacturing (shortened delivery times)

catalog(7)

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Technical Document) Volume 1: Characteristics of Hard Metals and Expectations for Layered Manufacturing (LPBF Method) / Efforts on Hard Metals × LPBF (Total of 5 Volumes)

Technical Document) Volume 1: Characteristics of Hard Metals and Expectations for Layered Manufacturing (LPBF Method) / Efforts on Hard Metals × LPBF (Total of 5 Volumes)

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Technical Document) 2nd Session: Challenges and Causes of Layered Manufacturing of Hard Alloys (LPBF Method), Powder Manufacturing Methods / Efforts on Hard Alloys × LPBF (Total of 5 Sessions)

Technical Document) 2nd Session: Challenges and Causes of Layered Manufacturing of Hard Alloys (LPBF Method), Powder Manufacturing Methods / Efforts on Hard Alloys × LPBF (Total of 5 Sessions)

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Technical Document) 3rd Session: The Effects of Heat Treatment Conditions After Additive Manufacturing of Cemented Carbide (LPBF Method) / Efforts on Cemented Carbide × LPBF (Total of 5 Sessions)

Technical Document) 3rd Session: The Effects of Heat Treatment Conditions After Additive Manufacturing of Cemented Carbide (LPBF Method) / Efforts on Cemented Carbide × LPBF (Total of 5 Sessions)

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Technical Document) 4th Session: The Effect of Carbon Content on Reducing Brittle Phases in the Layered Manufacturing of Hard Alloys (LPBF Method) / Efforts on Hard Alloys × LPBF (Total of 5 Sessions)

Technical Document) 4th Session: The Effect of Carbon Content on Reducing Brittle Phases in the Layered Manufacturing of Hard Alloys (LPBF Method) / Efforts on Hard Alloys × LPBF (Total of 5 Sessions)

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Technical Document) Case Study on the Application of Laminated Manufacturing of Hard Alloys (LPBF Method) to Deep Drawing Press Molds / Efforts on Hard Alloys × LPBF (Total of 5 Parts)

Technical Document) Case Study on the Application of Laminated Manufacturing of Hard Alloys (LPBF Method) to Deep Drawing Press Molds / Efforts on Hard Alloys × LPBF (Total of 5 Parts)

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Introducing a 3D printer ultra-hard powder that achieves a hardness equivalent to HRA92! This is a presentation of a molded body made using a newly developed WC-TiC-Co based powder for additive manufacturing.

Introducing a 3D printer ultra-hard powder that achieves a hardness equivalent to HRA92! This is a presentation of a molded body made using a newly developed WC-TiC-Co based powder for additive manufacturing.

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Introduction of ultra-hard alloy powder developed for 3D printers.

Introduction of ultra-hard alloy powder developed for 3D printers.

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Notice of Participation in Nanotech 2026 (January 28-30)

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We will be exhibiting at the "nano tech 2026 International Nanotechnology Comprehensive Exhibition and Technical Conference" held at Tokyo Big Sight (West Hall 3, Booth No. 3W-H14) from January 28 (Wednesday) to January 30 (Friday), 2026. At our booth, we will showcase various functional powders that we are developing. We invite you to visit our booth. ◆nano tech 2026 International Nanotechnology Comprehensive Exhibition and Technical Conference◆ Dates: January 28 (Wednesday) to January 30 (Friday), 2026 Opening Hours: 10:00 AM to 5:00 PM Venue, Our Booth Location: Tokyo Big Sight, West Hall 3, Booth No. 3W-H14 Nanotech2026 Official Website: https://www.nanotechexpo.jp/ Registration is required for entry to nano tech 2026. Please obtain your visitor badge in advance and come to the event. https://unifiedsearch.jcdbizmatch.jp/nanotech2026/jp/invitation/5ayDY47cpRY

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フジミインコーポレーテッド

フジミインコーポレーテッド

Electronic Components and Semiconductors

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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.

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