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  6. [New Development] Two-component Heat-Curing Epoxy Resin TE-6409FR

[New Development] Two-component Heat-Curing Epoxy Resin TE-6409FR

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last updated:Oct 22, 2025

寺田
寺田
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Transparent, difficult to yellow, flame-retardant epoxy resin equivalent to V-0. Low viscosity with excellent workability. Widely usable from transparent sealing to clear panels.

"TE-6409FR" is a two-component transparent epoxy resin suitable for electronic component encapsulation and craft applications where transparency is required. The mixing ratio of the base agent to the hardener is 100:50, and the mixed viscosity is only 500 mPa·s, making it a low-viscosity design that allows for easy filling of details and uniform coating. It demonstrates over 90% transparency (420-600nm transmission) and is suitable for applications where appearance quality is important. Furthermore, it achieves excellent yellowing resistance, showing no discoloration even after a heat resistance test at 120°C for 1,000 hours, combining aesthetics with reliability. Additionally, it is flame-retardant, contributing to safety assurance. Applications include electronic component encapsulation, transparent panels, clear photo panels, and art crafts, making it versatile across various fields. 【Features】 ■ Two-component transparent epoxy resin (mixing ratio 100:50) ■ High transparency (over 90% transmission at 420-600nm) ■ Excellent workability with low viscosity of 500 mPa·s *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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?TE-6409FR

[New Development] Two-component Heat-Curing Epoxy Resin TE-6409FR

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  • Related Link - https://www.trd.co.jp/
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【Other Features】 ■ Weather resistance that does not yellow even at 120℃ for 1,000 hours ■ Flame retardant: Equivalent to UL94 V-0 (5mm thickness) ■ High insulation: Volume resistivity > 1×10^15 Ω·cm ■ Wide applicability from electronic component encapsulation to craft and panel uses *For more details, please download the PDF or feel free to contact us.

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【Applications】 ■ Sealing of small motors, sensors, and electronic components ■ Crafts and panels *For more details, please download the PDF or feel free to contact us.

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[New Development] Two-component Heat-curing Epoxy Resin TE-6409FR

[New Development] Two-component Heat-curing Epoxy Resin TE-6409FR

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寺田

寺田

Electronic Components and Semiconductors

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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.

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