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  6. Support for SiC and sapphire: Specially shaped dummy wafers available from just one piece.

Support for SiC and sapphire: Specially shaped dummy wafers available from just one piece.

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last updated:Nov 28, 2025

ミツル光学研究所
ミツル光学研究所
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In addition to V-notch and orifice processing in accordance with SEMI standards, additional machining such as notching and drilling is also possible. We support research and development from a single prototype to mass production.

We manufacture dummy wafers that can be used for transport tests and condition setting in the development of power semiconductors such as SiC and GaN. We also have extensive experience in processing difficult-to-cut materials (SiC, sapphire, ceramics, etc.). ▼ Do you have any of these concerns? In the process development of next-generation power semiconductors, do you face the following challenges? - You need dummy wafers that comply with **SEMI standards (V-notch with orifice)** for testing, but cannot produce them in small lots. - You want to create the same shape using heat-resistant quartz or glass as an alternative to expensive SiC substrates. - You require special thickness or recessed processing tailored to your equipment, but there are no vendors that can accommodate this. Mitsuru Optical Laboratory's "prototype support capabilities" and "difficult material processing technology" will solve these challenges. 【Feature 1】Supports processing of "difficult-to-cut materials" from quartz to SiC and sapphire. 【Feature 2】Fusion of shape processing compliant with SEMI standards and "special processing." 【Feature 3】"We will turn your requests into reality." Quick response from a single prototype.

    Other semiconductors
画像_ミツル光学研究所.png

Support for SiC and sapphire: Specially shaped dummy wafers available from just one piece.

画像_ミツル光学研究所.png
画像_ミツル光学研究所.png
  • Related Link - https://www.mitsuru-op.co.jp/home/

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basic information

Compatible materials: quartz, alkali-free glass, SiC, sapphire, ceramics, etc. Shape processing: V-notch, orifice (compliant with SEMI standards), outer diameter polishing Special processing: recessing, drilling, thinning, chemical strengthening Supported lots: from prototype of 1 piece to mass production

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Applications/Examples of results

- Dummy wafers for transport robot evaluation (quartz, glass, SiC, etc.) - Monitor substrates for film formation and etching condition development - Heat-resistant and chemical-resistant glass wafers - Special-shaped and hole-punched glass jigs

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ITO film polishing process

ITO film polishing process

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Irregular shape cutting processing

Irregular shape cutting processing

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ミツル光学研究所

ミツル光学研究所

Glass and clay products

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Mitsuru Optical Research Institute has gained a high reputation in the fields of optical glass processing and LCD glass substrate processing, leveraging cutting-edge technology and equipment. In recent years, we have seen an increase in requests for support glass for the wafer thinning process in the semiconductor industry, which demands strict TTV, by applying our cultivated processing technology. Additionally, by utilizing scrap materials from LCD processing, we are pleased to provide verification glass used in various fields at a low cost, not just value-added glass. We would be grateful if you could consult with us at least once.

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