Leave anodic bonding, metal-metal bonding, and plasma activation bonding to us!
We would like to introduce the processing contract services offered by M.T.C Corporation. With our extensive knowledge and experience gained from semiconductor processing, we provide MEMS contract processing services, including anodic bonding, metal-metal bonding, and plasma activation bonding in the bonding process. Additionally, we perform pre-treatment, film deposition, photolithography, etching, and electroplating. Please feel free to contact us if you have any requests. 【Processing Details】 ■ Pre-treatment ■ Film Deposition ■ Photolithography ■ Etching ■ Electroplating ■ Bonding *For more details, please download the PDF or feel free to contact us.
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Our company offers MEMS processing outsourcing, MEMS device development, and MEMS consulting services. Through MEMS technology, we create a prosperous future for people. Please feel free to contact us if you have any inquiries.
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