Metal furnace for semiconductor packaging

Achieving airtight sealing of ceramics and metals in a high-purity atmosphere.

In the semiconductor industry, the airtightness in the sealing process is crucial for product reliability and long-term performance maintenance. Particularly for semiconductor devices that are susceptible to temperature changes and external environmental influences, a strong bond between the sealing material and metal/ceramic materials is required. Inadequate sealing can lead to device failure or performance degradation. A metal furnace achieves strong sealing while controlling the thermal expansion differences between ceramics and metals by providing a high vacuum and clean atmosphere. This contributes to the improvement of semiconductor device reliability. 【Application Scenarios】 - High-purity annealing of thin films, electrodes, and optical components - Sealing of ceramics and metals 【Benefits of Implementation】 - Stabilization of wettability, interfacial strength, and airtightness in a low O2/H2O/HC environment - Prevention of contamination and carbonization in a carbon-free environment - Reduction of prototype to mass production cycles through rapid switching between vacuum and reducing atmospheres

Industrial Furnace