The explosive proliferation of IoT devices and the challenges of next-generation semiconductor implementation.
By 2030, it will reach 64 billion units. The evolution of hardware supporting the accelerating digital society.
With the advancement of IoT, new challenges of "heat" and "precision" are being presented in semiconductor packaging. The number of IoT devices, which was about 25 billion in 2020, is expected to reach approximately 64 billion by 2030. Many of these devices are composed of chips and substrates that are sensitive to heat, making it difficult to address them with conventional high-temperature packaging. To realize the virtual world with physical hardware, innovative technologies that operate at low temperatures and low thermal stress are essential. *Data summarizing the market forecasts and packaging challenges for IoT can be obtained here.*
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The document summarizing the forecast data and implementation challenges of the IoT market is available for download here.
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The document summarizing the forecast data and implementation challenges of the IoT market is available for download here.
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Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.
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