Ideal for high-aspect ratio filling, from research and development to mass production.
- Ideal for small hole filling prototypes such as glass interposers - Unique technology different from screen printing using vibration and vacuum - This solves difficult hole filling challenges
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basic information
- Work size: Minimum 200mm, maximum thickness 10mm - Alignment: Image alignment mechanism - Hole filling target aspect ratio: 1:40 * There are also large compatible models (GIP-700). Please feel free to inquire.
Price range
Delivery Time
Applications/Examples of results
- Filling holes in glass interposers with copper, silver, etc. - Permanent sealing resin filling for semiconductor packages and multilayer substrates - Filling holes with conductive materials in ceramic products
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Company information
The scope of printing technology is increasingly expanding into fields such as solar cells, smartphones, and various electronic components, with a growing demand for "high-precision screen printing" technology. Thanks to your support, our company is celebrating its 35th anniversary and has developed into a company that is recognized by global enterprises creating new markets for the next generation. Among the few manufacturers of high-precision printing machines, our technology is trusted and valued by our customers. Today, our products have become indispensable to the advancement of cutting-edge printed electronics, spanning a wide range from electronic components to solar cells, fuel cells, FPCs, and smartphones. Moving forward, we will continue to prioritize customer satisfaction as we have in the past, dedicating ourselves to technology development that anticipates the needs of the times, and striving to deliver even higher precision products and services to meet our customers' expectations, while continuing to take on challenges both domestically and internationally.
