Low viscosity, high thermal conductivity epoxy resin that contributes to improving the cooling performance of automobiles.
In the automotive industry, as the miniaturization and high performance of electronic devices progress, heat dissipation measures have become an important issue. In particular, electronic components such as Engine Control Units (ECUs) and power semiconductors require reliability under high-temperature conditions. TE-7900 achieves both high thermal conductivity and low viscosity, addressing these challenges. This enhances the heat dissipation of electronic components and contributes to the longevity and performance maintenance of products. 【Application Scenarios】 - ECU (Engine Control Unit) - Power Semiconductors - Onboard Motors 【Benefits of Implementation】 - Improved heat dissipation of electronic components - Enhanced product reliability - Extended product lifespan - Support for miniaturization and high performance
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basic information
【Features】 - High thermal conductivity (heat dissipation) 3.0W/mK - Low viscosity - Environmentally friendly (non-lead, non-halogen) - Low thermal expansion (less prone to cracking) 【Our Strengths】 Terada Corporation has many years of experience in the electronic devices and chemical products fields, providing optimal products tailored to customer needs. We leverage our expertise in resin and adhesive technology, along with our know-how in the electronics industry, to contribute to solving our customers' challenges.
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【Purpose】 ■ Heat dissipation insulation sealing for electronic components such as motors, coils, transformers, and capacitors.
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Company information
Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.
