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  6. [For automobiles] TE-7901K: Weight reduction and heat dissipation measures

[For automobiles] TE-7901K: Weight reduction and heat dissipation measures

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last updated:Mar 02, 2026

寺田
寺田
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A one-component epoxy resin that achieves lightweight automotive parts and thermal management.

In the automotive industry, reducing the weight of components has become a crucial challenge to achieve both improved fuel efficiency and safety. At the same time, with the proliferation of electric vehicles (EVs) and hybrid electric vehicles (HEVs), heat dissipation measures for motors and power devices are also essential. TE-7901K contributes to addressing these challenges with its lightweight design and high thermal conductivity for effective heat dissipation. 【Application Scenarios】 - Sealing of electronic components such as motors, inverters, and ECUs - Heat dissipation measures for onboard electronic devices 【Benefits of Implementation】 - Improved fuel efficiency through weight reduction of components - Enhanced reliability of electronic components due to high thermal conductivity - Improved workability due to its single-component nature

    Resin container
プレゼンテーション1.jpg

[For automobiles] TE-7901K: Weight reduction and heat dissipation measures

プレゼンテーション1.jpg
プレゼンテーション1.jpg
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【Features】 - One-component heat-curing epoxy resin (no mixing required, high workability) - High thermal conductivity: 6.5 W/m·K - Flame retardant: Equivalent to UL94 V-0 (5mm thickness) - High insulation and high heat resistance (Tg 110℃) - Suitable for heat dissipation and insulation sealing applications in electronic devices 【Our Strengths】 Terada Corporation has been providing its products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our resin and adhesive technology along with years of know-how in the electronics industry, we contribute to solving our customers' challenges.

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■Small motor, coil, sensor, electronic component encapsulation ■Power device encapsulation

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[New Development] One-component Heat-Curing Epoxy Resin TE-7901K

[New Development] One-component Heat-Curing Epoxy Resin TE-7901K

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寺田

寺田

Electronic Components and Semiconductors

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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.

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