Trustworthy Hynix, Micron, and Samsung memory available.
MOQ: 2,600 pcs Stock: Available in Hong Kong, can be shipped within Japan LT: 1-2 weeks Due to the fluid nature of stock, there is a possibility of it being sold out. Please feel free to contact us for the latest stock status.
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basic information
Manufacturer: Samsung Electronics Model Number: KHBBC4B03C-MC1K Memory Standard: HBM3E (High Bandwidth Memory 3E) Capacity: 36 GB (Gigabytes) Data Transfer Speed: Up to 8.0 Gbps or more (high-speed transmission per pin) Interface: Wide memory bus / 1024-bit or more (high bandwidth design) Package: Stacked high-density package Application Layer: Designed for high-performance applications
Price information
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Delivery Time
Applications/Examples of results
AI and Machine Learning Accelerators High-speed memory required for large-scale model processing and inference. Supercomputers / HPC (High-Performance Computing) Massive data processing for scientific and technical calculations and simulations. Applications for Data Centers Backend for big data analysis and cloud services. GPU and Graphics Acceleration 3D graphics and video processing that require high bandwidth.
Company information
Our company was founded in Hong Kong in 2008 and has established branches in Tokyo, Japan, Shenzhen, Shanghai, Suzhou, Dalian, and other locations. We aim to be a partner recognized and trusted by customers and suppliers, achieving mutual success, a platform provider for employees and industry elites to realize life value, a top-class hybrid distributor in the industry, and a cohesive enterprise. Please feel free to contact us if you have any inquiries.
