Cushion material for printed circuit board manufacturing "ACE BOARD(R)"
Cushioning material for substrate manufacturing that combines high heat resistance and lasting cushioning properties.
"ACE BOARD(R)" is a high-performance heat-resistant cushioning material made of high heat-resistant fibers. It is widely used in the production of printed circuit boards for smartphones and various other high-temperature pressing applications. 【Features】 ■ A wide range of options tailored to temperature ranges and required cushioning properties ■ Maintenance of cushioning properties: long life, reduction of waste ■ Non-gas: no generation of harmful gases 【Exhibition Information】 ■ Exhibition Name: New Functional Materials Exhibition 2026 ■ Venue: Tokyo Big Sight, West Exhibition Hall ■ Booth Number: 3W-F25, 3W-F28 (within the Japan Nonwoven Fabrics Association booth) ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations - Rinkai Line "Kokusai Tenjijo" Station, about a 7-minute walk - Yurikamome "Tokyo Big Sight" Station, about a 3-minute walk *For more details, please download the PDF or contact us. Samples are also available.
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【Lineup】 ■ Ace Board C, X, CX Series: Up to 300℃ ■ Ace Board Z Series: Up to 400℃ *For more details, please download the PDF or contact us.
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Cushion material for printed circuit board manufacturing *For more details, please download the PDF or contact us.
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