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  3. イチカワテクノファブリクス 株式会社イチカワテクノファブリクス
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イチカワテクノファブリクス 株式会社イチカワテクノファブリクス

addressTokyo/Bunkyo-ku/Bongo 2-14-15
phone03-3816-1127
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last updated:Apr 07, 2026
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イチカワテクノファブリクス Product Lineup

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Cushion material for printed circuit board manufacturing "ACE BOARD(R)"

Cushioning material for substrate manufacturing that combines high heat resistance and lasting cushioning properties.

"ACE BOARD(R)" is a high-performance heat-resistant cushioning material made of high heat-resistant fibers. It is widely used in the production of printed circuit boards for smartphones and various other high-temperature pressing applications. 【Features】 ■ A wide range of options tailored to temperature ranges and required cushioning properties ■ Maintenance of cushioning properties: long life, reduction of waste ■ Non-gas: no generation of harmful gases 【Exhibition Information】 ■ Exhibition Name: New Functional Materials Exhibition 2026 ■ Venue: Tokyo Big Sight, West Exhibition Hall ■ Booth Number: 3W-F25, 3W-F28 (within the Japan Nonwoven Fabrics Association booth) ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations - Rinkai Line "Kokusai Tenjijo" Station, about a 7-minute walk - Yurikamome "Tokyo Big Sight" Station, about a 3-minute walk *For more details, please download the PDF or contact us. Samples are also available.

  • Other polymer materials

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Aluminum extrusion felt "THERMOTEX(R)"

A rich lineup tailored to the temperature and transportation form of aluminum extruded materials!

"THERMOTEX(R)" is a heat-resistant felt that helps prevent scratches on delicate aluminum extrusions. Aluminum extrusions gradually cool down from the initial table, through the run-out table, to the cooling table and sorting table. Therefore, we offer a lineup of felts made from various types of fibers to match the temperature and transport conditions of the aluminum extrusions. [Product Forms] ■ Tube ■ Endless Belt ■ Pad *For more details, please download the PDF or feel free to contact us.

  • Other polymer materials

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Felt for steel plates (roll cover for galvanized line) *Materials available!

By adding more felt to the contact area (crown part), it is also possible to extend its lifespan!

"Felt for Steel Plates" is a product designed to prevent damage when heated steel plates, which still have a temperature of around 250-350°C, pass through rolls. Since they are prone to scratches due to contact with the rolls, a cover is placed on the roll surface. The felt is placed over the roll and secured by folding and fixing both ends. There is an increasing use of high-heat-resistant and high-strength poly(p-phenylene benzobisoxazole) (PBO) fibers in the crown area. 【Specifications Example】 ■ Roll Dimensions: φ1500mm × L2100mm ■ Material: PBO / Para-type Aramid ■ Crown Thickness × Width: 5.0mm × 1800mm *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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Cushion material "ACE BOARD X・CX Series"

For printed circuit board manufacturing! Recommended for FR-4, BT resin, and PPE boards, etc.

The "ACE BOARD X・CX Series" is a cushioning material for printed circuit board manufacturing that combines cushioning properties with thermal conductivity. It is compatible with automatic transport through adhesion and can be used at press temperatures of 200°C to 300°C. Additionally, it can be reused multiple times. You can select the most suitable cushioning material, so please feel free to consult us when needed. 【Features】 ■ Combines cushioning properties with thermal conductivity ■ Usable at press temperatures of 200°C to 300°C ■ Reusable ■ Compatible with automatic transport through adhesion *For more details, please refer to the PDF document or feel free to contact us.

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Cushion Material for Printed Circuit Board Manufacturing "ACE BOARD C Series"

Recommended for CEM-1, CEM-3, and FR-1 substrates! Supports automatic transport through suction.

The "ACE BOARD C Series" is a cushioning material for printed circuit board manufacturing that can be used at a press temperature of 200°C. It has the properties of both cushioning and thermal conductivity, making it reusable. You can select the most suitable cushioning material. Please feel free to consult us when needed. 【Features】 ■ Combines cushioning and thermal conductivity ■ Usable at a press temperature of 200°C ■ Reusable ■ Compatible with automatic transport via adhesion *For more details, please refer to the PDF document or feel free to contact us.

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Cushion material for printed circuit board manufacturing "ACE BOARD Z Series"

The decomposition temperature of the structural fiber (PBO) is 650°C! Recommended for LCP and fluorine substrates, etc.

The "ACE BOARD Z Series" is a cushioning material for printed circuit board manufacturing that possesses both cushioning properties and thermal conductivity. It can be used at press temperatures of 300℃ to 500℃ or lower and is reusable. Additionally, the decomposition temperature of the constituent fiber (PBO) is 650℃. Please feel free to consult us when you need assistance. 【Features】 ■ Combines cushioning properties and thermal conductivity ■ Usable at press temperatures of 300℃ to 500℃ or lower ■ Reusable *For more details, please refer to the PDF document or feel free to contact us.

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