Measures to Prevent Adhesion of Melted Resin in the Molding Process for the Chemical Industry
A must-see for those struggling with resin adhesion during resin molding!
The Solnas "S-2009" is effective for preventing resin adhesion during resin molding! Resin molding involves pouring molten resin into molds, but have you ever experienced resin sticking to the mold and not coming off during removal after cooling? For such troubles, "S-2009" exhibits outstanding non-stick properties. In particular, "S-2009" has a proven track record with polyethylene-based resins. Our company is equipped with various sizes of sintering furnaces, allowing us to accommodate a wide range of items from small to large. If you are facing issues with resin adhesion not only with molds but also in other processes, please feel free to consult us. If desired, we can also provide sample pieces in a 60×40 size, so do not hesitate to contact us.
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basic information
■S-2009 Coating Specifications - Resin: PTFE Fluoropolymer Coating - Standard Film Thickness: Approximately 15 to 30 μm (Minimum Film Thickness Approximately 10 μm) - Color: Brown - Heat Resistance Temperature: 260℃
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Resin molding die
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Company information
Osaka Gas Chemical Co., Ltd. develops functional chemical businesses based on the technologies cultivated in the coal chemical and pharmaceutical-related sectors, realizing the enhancement of added value for our customers' products. As a leading company in each industry, we will continue to leverage advanced technology and abundant know-how to pave the way for the future together with our customers.
