Lead processing | Processing equipment and compatible sizes

Machining and laser cutting equipment for lead machining; compatible sizes.

■Machining Center (MC) Equipment: DMG Mori Seiki NVX5100 Processing Type: Cutting Thickness: Hard lead t1 ～ 9mm (0.5mm increments) Pure lead t1 ～ 5mm (1.0mm increments) Supported Sizes: Material Size: 10×10 ～ 1000×500mm Processing Size: 10×10 ～ 900×400mm Dimensional Tolerance: ±0.2 ～ 1.0mm ■Laser Processing Machine Equipment: Yamazaki Mazak Super Turbo X44 Processing Type: Laser Processing Thickness: Hard lead t1 ～ 9mm (0.5mm increments) Pure lead t1 ～ 5mm (1.0mm increments) Supported Sizes: Material Size: 10×10 ～ 1000×500mm Processing Size: 10×10 ～ 900×400mm Dimensional Tolerance: ±0.2 ～ 1.0mm ■Types of Lead Supported Hard Lead (4 types of hard lead plates): High-strength alloy lead plates with 4% antimony added. Suitable for use in environments from room temperature to 120°C, making it ideal for industrial applications requiring durability. Pure Lead (pure lead plates): High-purity lead plates with a purity of over 99%. Excellent flexibility and workability, capable of bending and accommodating complex shapes.

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