High-performance wafer-level test system compatible with wafers from 8 inches to 12 inches!
The "SWT5100" is a high-performance wafer-level test system designed for automated testing of silicon photonics wafers. It offers a fully automated testing process from wafer loading to optical alignment. Equipped with a chuck capable of temperature control from 25°C to 150°C, it supports optical, DC, and RF testing. It accommodates both GC and EC coupling and can be flexibly configured from single fibers to fiber arrays. 【Main Specifications (Partial)】 ■ Supported Wafer Size: 8 to 12 inches ■ Supported Wafer Thickness: 200 to 2000 um ■ Chuck Temperature Range: 25°C to 150°C ■ Supported Tests: Optical, DC, RF ■ Coupling Method: Grating coupling and edge coupling *For more details, please download the PDF or feel free to contact us.
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【Other Main Specifications】 ■Binding Speed: Less than 1.0 second (typical value) ■Binding Reproducibility: Less than 0.2 dB ■FAU Calibration Time: 3 minutes (automatic) ■Positioning System: Hexapod or 6-axis electric positioner ■Positioning Reproducibility: 0.1 µm *For more details, please download the PDF or feel free to contact us.
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Our company is a supplier that provides appropriate test solutions for advanced semiconductors such as CPOs and chiplets, utilizing high-speed optical/electrical measurement technology and wafer/chip-level handling technology. We offer test solutions that can consistently support everything from research and development to mass production processes, centered around three core technologies: high-speed signal processing technology, advanced handling technology, and high-precision analog signal processing technology. As a technology partner that creates the future together with our customers, we are always providing value that is one step ahead.
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