No harmful chemicals. Low cost. Eco-friendly. Organic protective coating that preserves solderability through long-term storage.
The Höllmüller OSP system by TSK applies a thin organic protective layer (Organic Solderability Preservative) to PCB copper surfaces. The process uses no harmful chemicals, making it one of the most environmentally friendly final finish options available. The protective layer is applied uniformly, then dried and cured to ensure consistent coating strength. Excellent solderability is maintained even after long-term storage and before assembly. Low material costs and minimal waste treatment expenses reduce both environmental impact and production costs. TSK Schill, certified to TÜV SÜD WHG standards, manufactures customized system modules with wastewater-reducing circuits and low-noise design. Distributed in Japan by World Link LLC.
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basic information
・Process: Uniform OSP organic coating, drying & curing ・Application: Final finish for PCB / HDI substrates ・Coating: Thin, uniform film; long-term storage compatible ・Chemicals: No harmful chemicals required (eco-friendly design) ・Configuration: Modular (pre-cleaning through final rinse in one line) ・Construction: High-durability polypropylene structure ・Environment: Wastewater-reducing circuits, low emissions & noise ・Certification: TÜV SÜD WHG certified ・Compatibility: Thin, thick, and flexible substrates ・All process parameters (chemistry, time, temperature) customizable per substrate
Price range
Delivery Time
Applications/Examples of results
・Oxidation prevention & solderability preservation for PCB / HDI copper ・Cost-efficient surface finish for consumer electronics PCBs ・Long-term storage compatible finish for automotive electronics ・High-reliability surface treatment for medical device PCBs ・Surface finish for telecom & 5G infrastructure boards ・RoHS-compliant lead-free finish across all industries OSP vs. Chemical Tin: OSP offers lower cost and no harmful chemicals, ideal for cost- or environment-sensitive applications. Chemical Tin provides higher re-heating resistance for multi-reflow processes. TSK Schill offers both, enabling optimal selection per application. Inquiries welcome.
Company information
Worldlink LLC Founded in 2022, Worldlink LLC is a professional industrial agency based in Osaka, Japan. Founder Mr. Peter has 23 years of professional experience in the semiconductor, solar energy, lithium battery and automation industries. The company has signed official agency cooperation agreements with German enterprises TSK, Photonics-Systems-Group, Ekvip Automation and Chinese enterprise Beijing Nanotop electronic Technology. WorldLink focusing on providing partners with Japanese market development, business connection and localized operation services.





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