[Book] Optical Devices Using Silicon Photonics (No. 2336)

~TIM, immersion cooling, vapor chamber, water-cooled heat sink~ ★ Achieving both 'high-density, high-heat cooling' and 'high-efficiency operation' required in data centers, as well as 'instantaneous heat countermeasures' and 'slim design' for AI-equipped PCs and smartphones! ---------------------------- ■ Table of Contents Chapter 1: Market trends for AI and generative AI data centers and the required heat dissipation and cooling technologies Chapter 2: Development of heat dissipation materials and components for electronic devices running AI, HPC, etc., trends, and responses to high heat density Chapter 3: Application of cooling technologies for stable operation of AI and generative AI, and responses to rapid heat generation Chapter 4: Design, analysis, and simulation of heat in advanced semiconductors and electronic devices Chapter 5: Heat dissipation and cooling technologies for devices and equipment equipped with AI and generative AI ---------------------------- ● Publication Date: March 31, 2026 ● Format: A4, 408 pages ● Authors: 40 ● ISBN: 978-4-86798-145-0 ----------------------------