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  6. Malico soldering type all-metal cold plate

Malico soldering type all-metal cold plate

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Malico Corporation (INTEL 4677 / INTEL 7529 / AMD SP5)

last updated:May 12, 2026

マイクロサミット
マイクロサミット
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Leak Zero's reliability. A one-piece molded brazing structure that supports extreme loads over 500W.

Malico's brazed cold plate is a high-efficiency, high-reliability cooling solution designed for next-generation AMD and Intel platforms with a power consumption exceeding 500W. Its main feature is the "all-metal brazed structure" that does not use any O-rings or gaskets. This fundamentally eliminates the risk of liquid leakage, enabling maintenance-free operation even under extreme workloads. Additionally, it is fully compliant with standard specifications, allowing for "plug-and-play" integration into existing systems. This minimizes the hassle of design changes while dramatically improving system stability and thermal efficiency. Furthermore, in addition to the standard lineup, custom solutions tailored to special layouts and advanced performance requirements are also offered. We respond quickly from prototyping to certification, supporting our customers' diverse needs.

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Malico soldering type all-metal cold plate

  • Related Link - https://www.microsummit.co.jp/news/20260501.html

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basic information

Using copper, which has excellent thermal conductivity, the common specifications include a fin thickness of 0.2mm, a fin spacing of 0.5mm, and support for a TDP of 500W. ■ INTEL 4677 Compatible CPU: Intel (LGA 4677 / 4710) Dimensions: 118 x 78 x 24 mm Weight: 548g Tube: Parker Push-Lok 1/4 inch ■ INTEL 7529 Compatible CPU: Intel (LGA 7529) Dimensions: 126.8 x 97.8 x 24 mm Weight: 776g Tube: Parker Push-Lok 1/4 inch ■ AMD SP5 Compatible CPU: AMD (SP5) Dimensions: 118 x 92.4 x 24 mm Weight: 735g Tube: Parker Push-Lok 1/4 inch

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It is ideal for the following cutting-edge infrastructure that requires advanced computing power and stability: AI and Machine Learning: AI clusters, AI training systems Computing Infrastructure: High-Performance Computing (HPC) Data Infrastructure: Data centers, data-intensive enterprise servers Custom Solutions: Cooling units for non-standard layouts and specialized AI accelerators In particular, it has gained high trust for its durability and ease of deployment in large-scale systems where downtime is not permitted.

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Electronic Components and Semiconductors

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Our company is an electronic components trading company established in 1986. We provide solutions for a wide range of applications, from smartphones to sensor networks. In line with the significant paradigm shift in the IT market, such as IoT and DX, we continuously research the global market to meet our customers' diverse technical needs and offer a rich lineup of products. Please feel free to contact us with your inquiries.

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