No need for drilling holes in the substrate. An innovative clip that can be secured simply by inserting it into the gaps of the BGA.
Malico's Uni-Holder is a groundbreaking BGA heat sink mounting solution that requires no mounting holes, anchor pads, or back plates on the circuit board. To meet the demand for "space-saving" in circuit board design, it adopts a unique structure that utilizes the slight gap (the height of the solder balls) between the PCB and the substrate for fixation. Springs incorporated at the four corners accommodate heat sinks of varying heights, protect components from vibrations during transport, and maintain stable thermal contact. Installation is completed in just a few seconds with a simple "click" without the need for tools, significantly reducing assembly costs. Rework is also easy, allowing for reuse more than 20 times. It offers the flexibility to be introduced immediately as an afterthought in cases where "thermal issues were discovered after design."
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basic information
It covers the main BGA sizes available in the market and can be combined with various fin shapes of heat sinks. - Supported BGA sizes: 19mm square to 55mm square (wide lineup) - Clip claw thickness: 0.18mm to 0.35mm (suitable for gaps in the substrate) - Fixing method: 4-point spring-loaded, snap-on attachment - Compatible gap: Supports 0.5mm to 0.7mm between PCB and substrate - Durability: Guaranteed for over 20 detachments and reuse - Example heat sink shapes: Forged pin fins, forged elliptical fins - Customization: Custom support for non-standard sizes is also possible.
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Applications/Examples of results
There is over 10 years of adoption history in various devices using BGA-type chipsets (FPGA, ASIC, etc.) in Japan. - Information and Communication: Servers, computers, radios - Industrial and Measurement: Industrial boards, measuring instruments, embedded boards - Commercial and Medical: POS terminals, medical devices, printers - Notable Mention: It is ideal for high-functionality boards where securing mounting holes is difficult due to high-density design or for "post-installation thermal measures" after the board design is completed.
Company information
Our company is an electronic components trading company established in 1986. We provide solutions for a wide range of applications, from smartphones to sensor networks. In line with the significant paradigm shift in the IT market, such as IoT and DX, we continuously research the global market to meet our customers' diverse technical needs and offer a rich lineup of products. Please feel free to contact us with your inquiries.
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