The batch spray system is an extremely efficient system that has low chemical consumption, requires minimal space, and enables various processes!
This document is a technical explanation regarding "BATCHSPRAY." Since it is specialized in wafer processing, it enables appropriate processes in various situations. It is noted that when considering the reactivity of the substrate surface, it is important to take into account the presence of the boundary layer. 【Contents】 ■ Introduction ■ Advantages of the Batch Spray System ■ Comparison with Other Systems ■ Conclusion *For more details, please download the PDF or feel free to contact us.
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Siconnex, headquartered in Europe, is a global manufacturer of wet process equipment for the semiconductor industry and related fields. We provide batch spray equipment for wet etching, cleaning, and resist stripping for a wide range of end products, including MEMS, power semiconductors, analog/mixed-signal semiconductors, and III-V semiconductors. Our equipment sets industry standards with safety, automation, compact footprint, high throughput, and efficient use of economic resources. There is a growing demand for our solutions as follows: - Environmentally friendly: cleaning and resist stripping with ozone - Optimal for small quantities and diverse processes with a small footprint - Automatic detection of etching end points with EPD - Efficient equipment that reduces chemical consumption
