Siconnex Japan(サイコネックス ジャパン) Product Lineup

This document contains information about the benefits of "SicOzone." Ozone is known as a very strong oxidizing agent and is effective in the oxidative decomposition of organic substances. It is stated that it can be discharged after use with minimal environmental impact. [Contents] ■ Introduction ■ Overview of Cleaning and Resist Stripping Processes using Ozone ■ Benefits of SicOzone ■ Conclusion *For more details, please download the PDF or feel free to contact us.

• Other cleaning equipment

This document is a technical explanation regarding "BATCHSPRAY." Since it is specialized in wafer processing, it enables appropriate processes in various situations. It is noted that when considering the reactivity of the substrate surface, it is important to take into account the presence of the boundary layer. 【Contents】 ■ Introduction ■ Advantages of the Batch Spray System ■ Comparison with Other Systems ■ Conclusion *For more details, please download the PDF or feel free to contact us.

• Other cleaning equipment

This document is a technical material proposing the "perc" process. Anisotropic dry etching is performed while forming a protective film, such as a polymer, to protect the sidewalls. Traditionally, cleaning has been done using dedicated organic solvent-based cleaning solutions, but this practice has started to be avoided due to safety and environmental concerns. 【Contents】 ■ Introduction ■ Process Overview ■ "perc" Cleaning Performance ■ Application to Plasma Dicing ■ Conclusion *For more details, please download the PDF or feel free to contact us.

• Other cleaning equipment

Our process integration solutions aim to streamline the wet processes in semiconductor manufacturing. Traditionally, wet etching, resist stripping, cleaning, and drying processes are often performed using individual equipment, which affects production efficiency and yield due to transportation between processes. Siconnex's batch spray system "BATCHSPRAY" allows for the use of multiple types of chemicals within a single chamber, enabling continuous processing of several wet processes without moving the wafers. This leads to reduced process time, space savings, and lower contamination risks. 【Features】 - Continuous processing of multiple wet processes in one chamber - Supports up to 8 types of process chemicals - Reduced contamination risk by minimizing wafer transport - Improved throughput through consolidated drying processes - Efficient use of space with a compact footprint design Additionally, it can be combined with ozone water processes (SicOzone) and organic solvent processes, allowing for the development of processes that consider reduced chemical usage and environmental impact. *For more details, please download the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment
• Resist Device
• Wafer

This 4-chamber system is characterized by its ability to achieve excellent process results by combining mixed chemicals at the time of use with a patented retainer comb treatment system. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. By continuously supplying new chemicals to the chamber, it eliminates processing variations due to bath liquid degradation, enabling stable high-precision processes. 【Features】 ■ For wet etching, resist stripping, and cleaning processes ■ Throughput of up to 600 wph ■ Four process chambers ■ Installation area of less than 12 m² ■ Chemicals used at low concentrations until depleted ■ No need for sulfuric acid or peroxides *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

This two-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It accommodates all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, enhancing flexibility and reducing processing steps. 【Features】 ■ Throughput of up to 300 wph ■ For wet etching, resist stripping, and cleaning processes ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recycling and reuse through a tank system ■ Capable of processing SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

This two-chamber system is designed for organic solvent-based chemicals for polymer residue and resist stripping. It includes a patented retainer comb processing system for the mixing of chemicals with high precision in the tank. Automatic management of moisture concentration in organic solvents is possible. 【Features】 ■ Throughput of up to 300 wph ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through a tank system ■ Process execution possible with SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

This 2-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It is compatible with all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, which not only enhances flexibility but also reduces processing steps. 【Features】 ■ Throughput of up to 300 wph ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through tank system ■ Process executable with sic/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

This 3-chamber system utilizes a patented retainer comb processing system, accommodating all types of wet etching processes and cleaning applications. The combination of acid/cleaning allows for high process flexibility and high throughput. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. 【Features】 ■ Throughput of up to 400 wph ■ Two cleaning process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through a tank system ■ EPD - End Point Detection *For more details, please download the catalog or feel free to contact us.

• Other semiconductor manufacturing equipment

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimized installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Installation area of less than 2 m² ■ Chemical recirculation via tank system ■ Process executable with SiC/GaN ■ Usable with 25 or 50 wafer chambers ■ Extractable process chamber ■ ATEX safety standards *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

After dry etching, the polymer residue left on the sidewalls has traditionally been removed using organic solvent-based chemicals, but it is becoming increasingly difficult to procure these due to environmental, safety, and sustainability concerns. Siconnex has developed the 'perc (Post Etch Residue Clean)' process, which uses inorganic chemicals commonly used in semiconductor fabs to remove polymer residues after dry etching. 【Features】 ■ Removes polymer residues using inorganic chemicals ■ Reduces chemical costs and waste disposal costs ■ Installation area of less than 2m² ■ Can be combined with a tank system to perform etching and resist stripping with one unit ■ Chamber capable of processing 25 or 50 wafers in a single batch *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 - Reduces chemical costs by using ozone instead of hydrogen peroxide for conventional RCA cleaning. - No special specifications are required as it does not use high-concentration ozone water. - Integrates with other wet processes such as etching and resist stripping, allowing multiple processing steps to be carried out without moving the wafers. - Ozone decomposes easily, reducing waste disposal costs. - Installation area of less than 2m². - Capable of using chambers for 25 or 50 wafers. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

The peeling of ozone resist has been researched and developed for over 20 years, but the challenge of using ozone, which easily decomposes and diffuses, in the process is high, and the currently practical methods require dedicated ozone process equipment. At Siconnex, we enable the ozone resist peeling process using our unique BATCHSPRAY technology, allowing it to be performed with the same equipment used for other wet processes such as etching and cleaning. This means that multiple processes can be carried out with a single machine, providing a space-saving and process-integrated solution. 【Features】 - Resist peeling is possible with only ozone and water. - No special specifications are required since it is not high-concentration ozone water. - Integration with other wet processes such as etching allows multiple processing steps to be performed without moving the wafers. - Reduces running costs by not using chemicals other than ozone. - Lowers waste disposal costs due to the easy decomposition of ozone. - Can be enhanced with the addition of inorganic chemicals if removal becomes difficult due to resist alteration. - Installation area is less than 2m². - Chambers for 25 or 50 wafers are available. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Uniformity with less than 1% variation ■ Installation area of less than 2 m² ■ Chemical recirculation through a tank system ■ Process executable with SiC/GaN ■ Usable with chambers for 25 or 50 wafers ■ Extractable process chamber *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Our company is a manufacturer of equipment for the semiconductor chip manufacturing process (wet etching, resist stripping, cleaning). We offer a variety of products, including the "BATCHSPRAY Clean Autoload" with a maximum throughput of 600 wph and the "BATCHSPRAY Solvent Autoload," which employs a chemical circulation system with a tank system. Please feel free to contact us when you need assistance. 【Reasons to Choose Siconnex】 ■ 100% focus on BATCHSPRAY technology ■ Significant reduction in water, exhaust, and chemicals ■ Cost-efficient processes that support environmental conservation ■ Comprehensive support system (service, parts, processes) ■ Partnership approach with free annual equipment inspections, training, telephone support, and regular maintenance in the first year *For more details, please refer to the PDF materials or feel free to contact us.

• Other semiconductor manufacturing equipment