Recycling and regeneration processing of ultra-hard tools for semiconductors.

We will regenerate ultra-hard tools that are on the verge of being discarded for wafer cutting applications.

In the semiconductor industry, particularly in the field of wafer cutting, precise and stable processing accuracy is required. The loss or wear of cutting tool edges can directly lead to a decline in cutting quality and a deterioration in yield. Tools that have previously had to be discarded can once again demonstrate their performance through our recycling process. We also accommodate changes to shapes based on customer requests, reviving them as optimal tools for wafer cutting. 【Usage Scenarios】 - Tool wear and damage during wafer cutting - Extension of tool life in precision machining - Achieving both cost reduction and waste reduction 【Benefits of Implementation】 - Maintenance and improvement of cutting quality - Stabilization of productivity - Reduction of environmental impact

Processing Contract