[Case Study of Pressure Measurement Film] Die Collet

A case that reduced chip extraction and transport errors, achieving quality improvement and yield enhancement!

This is an example of using "Presscale" to adjust the chip suction fixture for die bonding in semiconductor manufacturing. If the suction nozzle does not make uniform contact with the semiconductor chip, it can lead to retrieval failures and damage to the chip. In recent years, as wafers have become thinner and more prone to cracking, more stringent management has become necessary. When switching the suction nozzle, we first check with Presscale and adjust the parallelism before starting the die bonding process. This helps prevent process anomalies and quality issues caused by transport during suction. 【Case Overview】 ■ Objective: Reduce retrieval and transport errors of chips in die bonding ■ Measurement Target: Suction fixture during die bonding ■ Application: Adjustment of chip suction fixture (die collet) for die bonding ■ Results: Improved quality and yield *For more details, please download the PDF or feel free to contact us.

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