A case that reduced chip extraction and transport errors, achieving quality improvement and yield enhancement!
This is an example of using "Presscale" to adjust the chip suction fixture for die bonding in semiconductor manufacturing. If the suction nozzle does not make uniform contact with the semiconductor chip, it can lead to retrieval failures and damage to the chip. In recent years, as wafers have become thinner and more prone to cracking, more stringent management has become necessary. When switching the suction nozzle, we first check with Presscale and adjust the parallelism before starting the die bonding process. This helps prevent process anomalies and quality issues caused by transport during suction. 【Case Overview】 ■ Objective: Reduce retrieval and transport errors of chips in die bonding ■ Measurement Target: Suction fixture during die bonding ■ Application: Adjustment of chip suction fixture (die collet) for die bonding ■ Results: Improved quality and yield *For more details, please download the PDF or feel free to contact us.
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【Introduction Effects】 ■Quality Loss Effect: Abnormal products are released due to inspection errors. ■Material Loss Effect: Abnormalities discovered during final inspection (hundreds of thousands of yen per switch). ■Time Loss Effect: Adjustments made through trial and error result in approximately one day's time loss (tens of thousands of yen per switch). *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Our Measurement Film Solutions Division offers a variety of products, including high-temperature press scales and UV scales. We have the film "Press Scale," which allows for easy confirmation of invisible pressure and pressure distribution, and the revolutionary thermal distribution visualization film "Thermo Scale," which enables simple judgment of thermal distribution through color changes. Additionally, we provide a wide range of excellent inspection and measurement products that enhance precision, efficiency, and stability in manufacturing, inspection, and testing processes, all developed from the production processes of Fujifilm products.
