A case where it became possible to quickly and easily obtain empirical measurement information when a malfunction occurred!
We will introduce a case where "Presscale" was used to check the pressure uniformity during thermal bonding in the thermal bonding section of a wafer bonding device. The pressure applied to the object has a significant impact on the bonding quality. If the pressure is not uniform, issues such as poor sealing, uneven bonding strength, and inconsistent pattern width may occur. By using Presscale, the condition of the bonding surface can be quickly and easily confirmed, reducing the time and effort required for root cause analysis and adjustments. 【Case Overview】 ■ Objective: Ensure high bonding quality through pressure uniformity during thermal bonding ■ Measurement Target: Thermal bonding section of the wafer bonding device ■ Application: Check pressure uniformity during thermal bonding ■ Results: Defect analysis, reduction of defective products, cost reduction ■ Challenges: Poor sealing, uneven bonding strength, inconsistent pattern width *For more details, please download the PDF or feel free to contact us.
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【Introduction Effects】 ■Efficiency improvement in hot pressing unit design tasks ■Check for uniformity in hot pressing ■Analysis in case of defects *For more details, please download the PDF or feel free to contact us.
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Our Measurement Film Solutions Division offers a variety of products, including high-temperature press scales and UV scales. We have the film "Press Scale," which allows for easy confirmation of invisible pressure and pressure distribution, and the revolutionary thermal distribution visualization film "Thermo Scale," which enables simple judgment of thermal distribution through color changes. Additionally, we provide a wide range of excellent inspection and measurement products that enhance precision, efficiency, and stability in manufacturing, inspection, and testing processes, all developed from the production processes of Fujifilm products.


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